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Current has been used a wide range of high power LED, everybody is in contact with LED products to bring great convenience as well as the problems of concern, the first is high power LED its own nature, there is a poor luminescence uniformity, use of life is not long, especially the LED chip heat dissipation problems is not very good, so you can't exert the merits of high power leds.

Current has been used a wide range of high power LED, everybody is in contact with LED products to bring great convenience as well as the problems of concern, the first is high power LED its own nature, there is a poor luminescence uniformity, use of life is not long, especially the LED chip heat dissipation problems is not very good, so you can't exert the merits of high power leds. LED chips are characterized by extremely high heat in a very small volume. The heat capacity of the LED itself is very small, so it is necessary to transfer the heat out quickly, otherwise a high junction temperature will occur. To get as much heat out of the chip as possible, many improvements have been made to the chip structure of the LED. In order to improve the heat dissipation of LED chip itself, the substrate material with very good heat conduction is selected.

Is it necessary to choose silica gel as packaging material in high-power LED? Because silica gel to the same wavelength of light absorption of less than 1%. However, the absorption rate of epoxy resin to 400-459nm light is up to 45%, which is simply due to the long-term absorption of this short-wavelength light due to the aging that occurs in the future. Of course, in the practice of life will also present a lot of high-power LED white light chip cooling such questions, because we on the wide use of high-power LED white light will present more in-depth difficult to solve all kinds of questions!

A heat sink is usually made by Copper or Aluminum alloy. It is a passive heat sink that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often  use air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LED lights),  where the heat dissipation ability of the component itself is insufficient to moderate its temperature. 

In more extreme lighting situations, some type of active cooling may be required. This may be due to high heat flux from nearby leds, small size or surface area that is unable to conduct natural convection, or extremely high ambient temperature conditions. Any of these conditions may change the thermal budget of certain areas and require active cooling systems.

Various "standard methods" for active electronic cooling have been proposed or are also used for leds, although some special conditions apply to active LED cooling.
To date, the led cooling system has used or recommended the use of simple dc rotating fans, thermoelectric coolers (TEC), piezoelectric fans (PZF), synthetic jets (SJ) and liquid cooling (such as microchannels). Each of these has specific advantages, but there are also some disadvantages to the cooling lighting system.

Active cooling of lighting has special requirements that are not required for every semiconductor application. For example, most lighting systems must not produce unpleasant noise levels. This means that any active cooling system must be quiet, and unless precautions are taken, a moving active system can produce unwanted noise.

Other considerations for active optical cooling systems include: 

·  low power consumption --  as efforts continue to improve energy and further increase the energy star rating of LED lamps

· Low sensitivity to dust/external contaminants -- this is a problem for systems with moving parts and airflow

· ability to withstand periodic loads - problematic due to frequent switching on and off of lights

· increased system costs -- a problem that liquid loop systems (such as microchannels) face today

·  service life -- LED products are typically 50,000 hours

For all these problems, is there any reason to consider active cooling? Given how leds glow, the answer is yes. Many leds can increase the light output by increasing the current input until the current saturation point is reached. Today, the most expensive part of an LED system is the LED itself. If the number of leds could be reduced by driving them at a higher current, the cost of the system could be greatly reduced. Increased costs for active cooling systems can actually reduce overall system costs by reducing the number of leds.Therefore, a good active cooling system, if properly designed, is an advantage, which means it must be efficient, quiet, reliable and cost effective.

IGBT is a very important high-power device, and also the core device of energy transformation and transmission. In the field of power electronic devices, its importance is equivalent to "CPU". IGBT is also a national strategic emerging industry, widely used in rail transit, smart grid, aerospace, electric vehicles and new energy equipment.

IGBT module of power electronic equipment has the characteristics of large power, high heat flux density and compact structure. However, the conductivity of water should be considered in the heat dissipation by liquid cooling plate. The deionization system with purification function should be used for ion exchange, which will increase the failure nodes. Besides, liquid cooling is not conducive to the improvement of safety, and there is also the problem of regular maintenance.

And heat sink with heat pipe can transfer the heat from the base to the IGBT heat sink fin evenly, which can effectively solve the heat dissipation problem of high heat flux, not only high efficiency, but also compact structure, no moving parts, can really achieve maintenance-free, so IGBT heat pipe heat sink has been widely recognized by the industry users.

The liquid cooled heatsink has a very good effect on the heat dissipation of high-power devices, so many users will choose the heat dissipation scheme of the liquid cooled heatsink. The production process of the liquid cooling plates is more complicated than that of the general air cooled heat sink, and the liquid cooling heat dissipation requires higher reliability on the process, so only the strong technical precipitation manufacturers can provide reliable technical support. LORI heat sink has been providing customers with high quality liquid cooled heatsink and liquid cooling solution for many years.

Pressured tube technology is the most used liquid cooling heat sink production custom process, generally speaking, is aluminum base buried copper tube, the aluminum base with CNC machining milling groove, and then using a press will have been bent shape of copper tube pressed to aluminum base, brazing welding, and then after processing into water cooling plate. Buried tube type liquid cooling plate generally has three forms: one is shallow buried tube liquid cooling plate; Second, deep buried tube liquid cooling plate; Three is the welding pipe technology; Four is the double-sided clamp tube technology liquid cooling plate.The three forms of technology are not different, the processing difficulty is the same. Some liquid cooling principles originally designed for high-power switching devices can also be used for reference in power battery cooling systems.