Current has been used a wide range of high power LED, everybody is in contact with LED products to bring great convenience as well as the problems of concern, the first is high power LED its own nature, there is a poor luminescence uniformity, use of life is not long, especially the LED chip heat dissipation problems is not very good, so you can't exert the merits of high power leds.

Current has been used a wide range of high power LED, everybody is in contact with LED products to bring great convenience as well as the problems of concern, the first is high power LED its own nature, there is a poor luminescence uniformity, use of life is not long, especially the LED chip heat dissipation problems is not very good, so you can't exert the merits of high power leds. LED chips are characterized by extremely high heat in a very small volume. The heat capacity of the LED itself is very small, so it is necessary to transfer the heat out quickly, otherwise a high junction temperature will occur. To get as much heat out of the chip as possible, many improvements have been made to the chip structure of the LED. In order to improve the heat dissipation of LED chip itself, the substrate material with very good heat conduction is selected.

Is it necessary to choose silica gel as packaging material in high-power LED? Because silica gel to the same wavelength of light absorption of less than 1%. However, the absorption rate of epoxy resin to 400-459nm light is up to 45%, which is simply due to the long-term absorption of this short-wavelength light due to the aging that occurs in the future. Of course, in the practice of life will also present a lot of high-power LED white light chip cooling such questions, because we on the wide use of high-power LED white light will present more in-depth difficult to solve all kinds of questions!