BGA cooling problems get more and more people enough attention, LORI a China heat sink manufacturer has launched a series of heat sink products on the market, BGA memory heatsink is a heatsink set specially designed for BGA chipset, well liked by customers, this heat sink product is Lori's first chip cooling product for a single chip in a long time.

Although these two heat sinks are designed to BGA encapsulated chip cooling, the material and the price are different, one is made of aluminum, while the other is made of pure copper, so the prices are far different.

We know that there are not many memory cooling modules that can be used for BGA packaging in the market before, and most players have to DIY. Now Lori has launched a cooling module that can be used for BGA packaging video memory.

As for bga heat sink modeling, you can match and put it in any way according to different cooling interfaces, so as to achieve ideal regional cooling effect. It is worth noting that this heat sink module is not only easy to install, but also the most important thing is to ensure the compatibility with the cooling device of the video card introduced by LORI, such as the water cooling plate of LORI's video card and the heat pipe cooling.