Liquid cold plate manufacturers pose a great threat to modern electronic equipment, which will lead to unstable operation of the equipment system, shorten the service life, and even burn some parts. Because of the high temperature caused by the paralysis of a lot of equipment, people came up with many ways to solve the problem. Heat sink is the measures to solve the heat dissipation). In many electronic products have Heat sink, such as computer, etc. As a result of product variety more, heat sink variety. liquid cooling plate are one of them.

A cold plate heat sink is a forced circulation of a pump-driven liquid to take away its heat. Compared with the air cooling heat sink , it has the advantages of quiet, stable, little dependence on the environment, etc., The heat dissipation efficiency of the heat sink manufacturer of water cooling plate is related to the thermal conductivity of the heat sink material, the heat capacity of the heat sink material and heat sink medium and the effective radiant area of the heat sink.

Want to know more information on the cost of cold plate, please click on "Cold Plate Manufacturing Cost ".

According to the way of heat taking, the Heat sink is divided into two categories: active heat dissipation and passive heat dissipation.The former is the air cooling Heat sink, the latter is the Heat sink cooling further subdivision can be divided into air cooling, heat pipe, liquid cooling, semiconductor making and compressor refrigeration.Air cooling is the most common and very simple, that is to use the fan to take away the heat absorbed by the Heat sink it has the advantages of relatively low price, simple installation, the goal of the environment is very strong physical such as when the temperature and rate is too high, its thermal performance will be greatly affected

According to the way of heat taking, the Heat sink is divided into two categories: active heat sink and passive heat sink .The former is the air cooling Heat sink, the latter is the Heat sink cooling further subdivision can be divided into air cooling, heat pipe, liquid cooling, semiconductor making and compressor refrigeration. Air cooling is the most common and very simple, that is to use the fan to take away the heat absorbed by the Heat sink it has the advantages of relatively low price, simple installation, the goal of the environment is very strong physical such as when the temperature and rate is too high, its thermal performance will be greatly affected.