In the early days of computers, there weren't many computer components that used large heat sink. With the increasing power of computers and prevalence of overclocking among computer players, modern computers have increasingly high requirements for the heat sink of important components. Methods of heat-dissipating are various, basically divided into air cooling, chip heat sink,  water cooled plate and so on.

The commonly used one---air cooling, in fact, is heat sink fins with good thermal conductivity tightly against the larger chip. Above the heat sink there is a small fan.  In this way, the airflow generated by the high-speed rotation of the fan takes the heat away from the fins. Pay attention to these points when choose air cooling: Regardless of the material problem, I believe there are still many people think that, the larger the size of the heat sink is, the better the heat dissipation effect can play. In fact, the quality of heat sink has no absolute connection with its "volume", but the "surface area" size and heat dissipation have a direct relationship. In other words, the greater the surface area of the heat sink is and the more grooves it has, the better it will be.